Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...

Cadence extends its AI agents beyond chips with AuraStack for circuit boards and packaging

Integrated circuit and electronic hardware design company Cadence Design Systems Inc. today announced a new artificial ...

Cadence Automates PCB Design With AI Super Agents

Cadence is rapidly deploying "Super Agents" to offer agentic AI support, now with AuraStack, for Printed Circuit Board and ...
TMCnet

Cadence Introduces AuraStack AI Super Agent, the World's First Agentic AI Platform for PCB and Advanced Packaging

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging ...
Business Wire

Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® OrCAD ® X Platform, a cloud-enabled system design solution that offers transformative ...
ITWeb on MSN

Streamlining Project Efficiency with

Streamlining Project Efficiency with Murata’s Pre-Installed Electrical Models in the Latest Versions of Cadence OrCAD X Capture™, Allegro X System Capture™ and AWR Design Environment™ (Microwave ...
Nasdaq

Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era

Improves energy efficiency by up to 30% with accurate and lightning-fast AI-driven digital twins SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) introduced the industry ...