Manage thermal challenges in compact, power-dense electronics using multiphysics simulation. Learn to predict heat transfer, ...
A prototyping problem is emerging in today’s efforts to electrify everything. What works as a lab-bench mockup breaks in reality. Harnessing and safely storing energy at grid scale and in cars, trucks ...
Register now for this upcoming webinar, hosted by multiphysics simulation software provider COMSOL, exploring how to train ...
Agreement enables LTSCT to leverage Synopsys’ multiphysics simulation technologies to enhance its design workflows across ...
Digitally prototyping complex designs, such as large physical structures, biological features, and micro-electromechanical systems (MEMS) requires supercomputers running sophisticated multiphysics ...
It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...
For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...
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