ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate ...

Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the ...

Tessolve’s $75 million raise highlights the growing strategic importance of outsourced semiconductor engineering. Chip ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Verify Device Functionality: Confirm logic, analog, RF, or memory blocks operate per specification. Characterize Parametric Performance: Measure leakage currents, threshold voltages, timing margins, ...

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

Imagine a world where every electronic device is tailored to its purpose with pinpoint precision. Custom ASICs, or Application-Specific Integrated Circuits, makes this a reality. Custom ASICs ...

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Cypress Semiconductor Corporation (NASDAQ: CY) today announced that the companies have signed a definitive agreement under which Infineon will ...