SEMI expects construction to begin on 20 new 300mm fabs or production lines globally in 2026, followed by another 18 in 2027, excluding facilities dedicated exclusively to research and development. In ...
ATLANTA, GA – ECIA announces the results of the September Industry Pulse survey: the overall component index average improved from 136.7 in August to 142.0 in September, beating expectations by 6.6 ...
CIRCUITS ASSEMBLY, the electronics assembly industry's leading trade publication and a title of the Printed Circuit Engineering Association (PCEA), has announced the winners of its 34th annual Service ...
SUZHOU, CHINA -- Suzhou Dongshan Precision Manufacturing has cleared a key regulatory hurdle for a planned Hong Kong listing that could raise up to $3 billion.
An overview of standards and guidelines for high-voltage applications. PCB line spacing is relevant to both safety and function when it comes to traces. Comprised of copper, fuses and insulation, a ...
Stop designing products guaranteed to fail EMC testing. Au: This article emphasizes the need to concentrate on design of transmission lines, or the “spaces,” instead of the “wires.” The industry focus ...
MINNEAPOLIS, MI -- Flexible Circuit Technologies Inc. (FCT), a Minnesota-based flexible circuit and advanced electronics manufacturer, is pleased to announce the development of its Liquid Leak ...
CAM350/DFMStream v. 14.5 and BluePrint-PCB v. 6 now support importation and visualization of CAD designs containing flex, rigid-flex and embedded component data in both 2-D and 3-D views. Focus on ...
SHENZHEN -- The board of directors of Shennan Circuits has unanimously approved a major investment to build a printed circuit board fabrication facility in Thailand. The company, through its ...
SANTA ANA, CA -- TTM Technologies has entered into a definitive agreement to acquire EPIQ Design Solutions and its subsidiaries from an affiliate of Veritas Capital for $1.1 billion. The transaction ...
MANAUS, Brazil – Quectel Solutions has opened a research and development center in Manaus, Brazil, expanding its engineering presence in Latin America and establishing its first R&D facility in South ...
BondFilm HF is for treatment of innerlayer cores. Reportedly offers low signal loss required in high-frequency applications. Requires reduced surface roughening, while maintaining excellent bond ...