AI-based digital post-distortion gains attention as uplink modulation performance and efficiency requirements grow on the path to 6G.

目前，市場對聚酰亞胺材料的要求，已從耐熱特性延伸至低溫製程、異質整合及高可靠度…等。 隨著AI、高效能運算、先進封裝及消費性電子產品快速發展，市場對聚酰亞胺(PI)材料的要求，已從 ...

New Delhi [India], September 15: PI Industries today announced the launch of CARVINT (Flometoquin 10% SC), a next-generation insecticide designed to provide effective control of Thrips and Diamond ...

The award recognizes the company’s development of a film that is roughly one-third the thickness of conventional 12.5µm polyimide film PI Advanced Materials, an Arkema affiliate, has been recognized ...