Accurately controlling film thickness and uniformity is extremely important for both throughput and performance in the automotive, aerospace, semiconductor, medical, and research industries. White ...

Accessibility has been a major factor while designing Windows 11. A lot of new options were added and the menu was revamped. Rather, the ease of access was such an important factor for the new ...

Every year, it seems like Apple introduces "the thinnest iPhone ever designed," and the release of the iPhone 17 lineup is no exception. The new iPhone 17 Air doesn't just boast a 6.5-inch display, ...

We knew it was coming, but it still blew our socks off. At the “Awe Dropping” press event today, Apple announced the iPhone Air, its ultra-slim flagship smartphone, which is just 5.6mm thick. It’s the ...

Apple's long-rumored foldable iPhone will likely have a starting price between $1,800 and $2,000 in the U.S., analysts at investment banking firm UBS said this week. If so, the foldable iPhone would ...

Users are being encouraged to switch to ZBrush for iPad when support ends on September 10th. Users are being encouraged to switch to ZBrush for iPad when support ends on September 10th. is a news ...

Increased endometrial thickness is a potential sign of endometrial cancer. Doctors are most likely to be concerned if you also experience bleeding. Endometrial thickness refers to the thickness of the ...

This year will be remembered as the year that smartphones got thinner and lighter. The trend kicked off with the world’s thinnest folding phone, the Oppo Find N5, in January, and it was quickly ...

Your brake rotors are simple yet critical parts of your vehicle's stopping power. Unfortunately, not many people bother checking or maintaining them. Let's be honest, folks: When was the last time you ...

Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...