Microchip Technology Inc. has expanded its data center portfolio with new connectivity, storage, and acceleration capabilities designed to meet the performance, security, and scalability needs of AI ...

At the OCP Global Summit, TI unveils three new chips for AI data centers—the 3-GSPS ADC, 800-V hot-swap controller, and BAW oscillator.

Artificial intelligence is reshaping data center architecture by changing where system bottlenecks occur. For years, networking discussions focused primarily on scale-out communication between servers ...

There are several ways to deploy a database on NAND flash memory: over a flash file system, over an FTL-provided block device, or with flash management integrated into the database storage layer. For ...

On July 13, the Pentagon hit pause on the biggest cybersecurity compliance program in the defense industrial base. In a memo signed by DoD chief information officer Kirsten Davies, the department ...

Qualcomm also announced a multi-year, multi-generation agreement with Meta, under which the Dragonfly C1000 CPU is planned for deployment in Meta’s next-generation server infrastructure. In addition, ...

Eggtronic has announced the availability of a 500-W solar microinverter reference platform developed in collaboration with Renesas Electronics. The new design combines Eggtronic’s EPIC mixed-signal ...

Zonal architectures are the basis for the design of new generation vehicles. Through more efficient management of electronic functions and software, they are destined to profoundly influence the ...

Beyond quantum computing, High NA EUV lithography is also expected to play a major role in manufacturing advanced AI processors and high-performance computing chips. imec’s latest demonstration ...

The surge in complexity of modern SoCs, driven by the integration of heterogeneous compute elements, advanced packaging techniques, and stringent power and performance demands, has led to an ...

At Nvidia GTC 2026, chipmakers, including Navitas, STMicroelectronics, and Texas Instruments, have announced several new power products to support Nvidia’s 800-VDC power architecture reference design ...

Cadence Design Systems Inc. has launched an agentic AI solution for automating front-end silicon design and verification. Claiming the first agentic workflow for automating chip design and ...